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SK hynix breaks ground on its $4 billion Indiana packaging plant
The August milestone moves the West Lafayette project beyond its 2024 announcement. The future factory workforce is separate from construction hiring.
Semiconductors construction news
What is being built. Who is doing the work. What it means for your crew.
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Micron's Clay fab moves from site work to vertical construction
Micron poured first concrete in July and named Bechtel for its first New York fab. Specialty firms need to track procurement as the building phase advances.
TSMC tops out Fab 3 as Phoenix construction moves through different phases
The May milestone completes the third fab structure. Equipment installation and newer construction phases follow separate schedules.
Micron sets separate wafer targets for its two Idaho fabs
The July owner update targets first output in 2027 and 2028. Each fab needs its own construction and equipment schedule.